3M™ Trizact™ Polishing Pad HT-250: Revolutionizing Precision in Ultra-Hard Material Finishing 

Key Advantages:‌

• Ultra-Hard Material Mastery:‌ Exceptional lapping and polishing performance on challenging substrates like silicon carbide and ceramics.
• Superior Outcomes:‌ Achieve lower total thickness variation (TTV), faster removal rates, and superior surface finishes compared to traditional copper platen processes, especially when paired with 3M™ Trizact™ Composite Slurry.
• Sustainable Innovation:‌ An eco-friendly alternative to the copper platen process, eliminating the need for copper regrooving and copper in polishing waste.
• Durable and Efficient:‌ Benefit from a long pad life, ensuring consistent performance and cost-effectiveness.
• Precision Engineering:‌ Delivers good TTV, high removal rates, and an excellent surface finish, making it ideal for the rough lapping step.
• User-Centric Design:‌ Features easy pad replacement and the versatility to be directly mounted onto various lapping plates, including flat/smooth and waffle patterns.

Product Overview:‌
The 3M™ Trizact™ Polishing Pad HT-250 is a cutting-edge microreplicated silicon wafer lapping pad designed for finishing ultra-hard materials such as sapphire, silicon carbide, and ceramics with unparalleled precision and efficiency.

Application and Compatibility:‌

• Rough Lapping Excellence:‌ Perfect for use in the rough lapping process step, enhancing the initial stage of material finishing.
• Optimized Performance:‌ When used in conjunction with 3M™ Trizact™ Composite Slurries, it provides optimized performance, ensuring superior results.
• Versatile Adhesion:‌ Can be easily adhered to single- or double-sided lapping platens, offering flexibility and compatibility with existing equipment.

Typical properties